C - Chemistry – Metallurgy – 25 – F
Patent
C - Chemistry, Metallurgy
25
F
117/92, 204/86.5
C25F 3/04 (2006.01) C23C 20/04 (2006.01) C23C 24/00 (2006.01) C23F 17/00 (2006.01) E04B 1/94 (2006.01)
Patent
CA 1041942
ABSTRACT OF THE DISCLOSURE A heat resisting material is formed by treating one of both sides of an aluminum or aluminum alloy foil chemically, by electrolytic etching, or by mechanical roughening to remove 10-40 wt. % of original aluminum foil and then bonding a layer powdered aluminum to the etched surface of the foil not less than 2 microns in thickness.
174505
Itakura Sigeru
Matsui Teruo
Nakajima Toshio
Okawara Kenjiro
Na
Tokai Metals Co.
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