C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
402/418, 402/622
C08F 210/00 (2006.01) B29C 45/00 (2006.01) C08F 210/16 (2006.01) C08L 23/08 (2006.01)
Patent
CA 1117699
ABSTRACT OF THE DISCLOSURE An ethylene polymer having a density in the range Or about 0.940-0.960, a melt index in the range 100-200 and a ratio of weight-average molecular weight to number-average molecular weight of less than 5 is disclosed. The polymer is a copolymer of ethylene and at least one .alpha.-olefin having 4-10 carbon atoms e.g. butene-1, hexene-1 or octene-1. The preferred polymer is a copolymer of ethylene and butene-1. The polymers may be used in the injection moulding of thin- wall containers e.g. containers having a wall thickness of less than 0.7 mm, especially a thickness of less than 0.5 and in particular a thickness of less than 0.4 mm.
319110
Lovell Peter J.
Saunders Ian C.b.
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