Ethylene vinyl acetate compositions for dielectric sealing...

Details Ethylene vinyl acetate compositions for dielectric sealing... Ethylene vinyl acetate compositions for dielectric sealing...

C - Chemistry, Metallurgy

08

L

400/6488

C08L 27/06 (2006.01) C08L 31/04 (2006.01) C08L 23/08 (2006.01)

Patent

CA 1297217

ABSTRACT A binder suitable for dielectric sealing may be prepared comprising a blend of a polyvinyl halide emulsion and an aqueous emulsion comprising a vinyl ester of an alkanoic acid interpolymerized with a) 5 to 28% by weight of ethylene; b) 0.5 to 4% by a weight of an N-methylol containing copolymerizable monomer; c) 0 to 3% by weight of a latex stabilizer; and d) 0 to 1% by weight of at least one polyunsaturated copolymerizable monomer, the binder having a Tg of -15 to +35°C and being buffered to a pH greater than 7.

537515

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