B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 26/40 (2006.01) B23K 26/36 (2006.01) B23K 26/38 (2006.01) B32B 3/10 (2006.01) H05K 3/00 (2006.01)
Patent
CA 2377855
A method of ablating holes in a material, using a laminated material which includes a first layer (12) and a second layer (14). The first and second layers have different coefficients of thermal expansion. The first layer has a hole within it surround- ing a target region of the second layer in the laminated material. Thus, the target region is not laminated to the second layer but is surrounded entirely by laminated regions where the first layer (12) is laminated to the second layer (14). A laser source (40) produc- ing energy of a wavelength and a power level that can ablate material from the first layer is directed toward the target region after and/or during changing the temperature of the laminated material so as to place the target region under tension, thereafter ablation of the target region produces the desired holes.
L'invention concerne un procédé destiné à ménager des orifices dans une matière lamellaire comprenant une première couche (12) et une seconde couche (14). Lesdites première et seconde couches présentent des coefficients de dilatation thermique différents. La première couche comprend un orifice situé autour d'une zone cible de la seconde couche dans la matière lamellaire. Ainsi, la zone cible n'est pas plaquée contre la seconde couche, mais entièrement entourée de zones lamellaires, la première couche (12) étant plaquée, elle, contre la seconde couche. On dirige une source laser (40) produisant une énergie dont la longueur d'onde et l'intensité permettent l'ablation d'une matière de la première couche sur la zone cible après et/ou pendant le changement de température de la matière lamellaire de manière à mettre la zone cible sous tension, l'ablation de la zone cible formant alors les orifices souhaités.
Aradigm Corporation
Fetherstonhaugh & Co.
LandOfFree
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