Extremely tough thermosetting bismaleimide resin systems

Details Extremely tough thermosetting bismaleimide resin systems Extremely tough thermosetting bismaleimide resin systems

C - Chemistry, Metallurgy

08

L

400/4008

C08L 63/00 (2006.01) C08L 79/08 (2006.01) C08L 87/00 (2006.01)

Patent

CA 2025039

Bismaleimide resin systems containing low viscosity epoxy resins and a swellable or soluble thermoplastic when utilized to impregnate intermediate modulus carbon fiber are capable of preparing quasiisotropic composites, which, when cured, exhibit compression strengths after impact of greater than 47-50 ksi after an impact of 1500 in-lb/in.

Affiliated with

Also associated with

Rating

Extremely tough thermosetting bismaleimide resin systems does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Extremely tough thermosetting bismaleimide resin systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Extremely tough thermosetting bismaleimide resin systems will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1923670