Extrudable emi shielding film

B - Operations – Transporting – 29 – C

Patent

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Details

317/3, 18/60, 18

B29C 47/02 (2006.01) C08J 5/18 (2006.01) C08K 7/06 (2006.01) H01B 1/22 (2006.01) H05F 3/00 (2006.01) H05F 3/02 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2022974

ABSTRACT OF THE DISCLOSURE Disclosed is a conductive metallized flexible thermoplastic film for packaging static sensitive devices, such as electronic circuit boards. The film may be made by extruding metal-fibers or strands together with a thermoplastic polymer. Preferred metal strands are stainless steel. The films may be oriented, heat- shrinkable films. They afford ESD and EMI protection, and are called Type# film. 5/890713.1CA/SPECFLDR

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