Extrusion process for preparing improved thermoelectric...

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H01L 35/16 (2006.01) B21C 23/00 (2006.01) H01L 35/34 (2006.01)

Patent

CA 2710789

With respect to a method for reducing the thermal conductivity and for increasing the thermoelectric efficiency of thermoelectric materials based on lead chalcogenides or skutterudites the thermoelectrical materials are extruded at a temperature below their melting point and a pressure in the range of 300 to 1000 MPa.

L'invention concerne un procédé pour réduire la conductivité thermique et augmenter le rendement thermoélectrique de matériaux thermoélectriques à base de chalcogénures de plomb ou de skutterudites, consistant à extruder les matériaux thermoélectriques à une température inférieure à leur point de fusion, et à une pression comprise entre 300 et 1000 MPa.

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