Fabricating a hybrid imaging device

Details Fabricating a hybrid imaging device Fabricating a hybrid imaging device

H - Electricity

01

J

H01J 40/14 (2006.01) H01L 27/00 (2006.01)

Patent

CA 2355307

A hybrid detector or imager includes two substrates fabricated vender incompatible processes. An array of detectors, such as charged-coupled devices, are formed on the first substrate using a CCD fabrication process, such as a buried channel or peristaltic process. One or more charge-converting amplifiers are formed on a second substrate using a CMOS fabrication process. The two substrates are then bonded together to form a hybrid detector.

L'invention concerne un détecteur ou imageur hybride comprenant deux substrats fabriqués selon deux procédés incompatibles. Un réseau de détecteurs, par exemple des dispositifs de couplage de charge (DCC), est formé sur le premier substrat par un procédé de fabrication DCC, par exemple à canaux enterrés ou péristaltique. Au moins un amplificateurs de conversion de charge est formé sur un second substrat par un procédé de fabrication CMOS. Les deux substrats sont ensuite collés ensemble pour former un détecteur hybride.

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