Fabrication multilayer combined rigid/flex printed circuit...

H - Electricity – 05 – K

Patent

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Details

H05K 3/00 (2006.01) H05K 3/06 (2006.01) H05K 1/00 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2204532

Multilayer rigid flex printed circuits are fabricated from a novel basestock composite (10) comprising two copper conducting sheets (12, 14), bonded to insulator layers (16, 18) comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to Kapton layers (20, 23) wherein said Kapton layers are not coextensive with the borders (24) of the insulator layers. The basestock composite (10) can then be imaged and etched on the conductor layers (16, 18) to form conductor patterns (22), laminated or coated with a coverlay (30) of dielectric material, and the basestock can be cut at a point internal to its borders (24) and into the Kapton layers thereby separating two imaged and etched conductor layers.

Des circuits imprimés rigides et souples multicouches sont fabriqués à partir d'un nouveau matériau de support composite (10) comprenant deux feuilles de cuivre conductrices (12, 14), collées aux couches (16, 18) formant isolant, constituées de feuilles de fibres de verre imprégnées d'un adhésif tel que de l'époxy. Les couches formant isolant sont toutes deux fixées aux couches de Kapton (20, 23), ces couches n'étant pas coextensibles par rapport aux bords (24) des couches formant isolant. Les images peuvent alors être formées sur le matériau de support composite (10) et réalisées par photogravure sur les couches formant conducteur (16, 18) pour former des motifs de conducteurs (22), stratifiés ou recouverts d'une couche de revêtement (30) d'un matériau diélectrique. Ensuite, le matériau de support peut être coupé au niveau d'un point interne par rapport à ses bords (24) et dans les couches de Kapton, séparant ainsi deux couches formant conducteur imagées et réalisées par photogravure.

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