Fabrication of circuit packages

Details Fabrication of circuit packages Fabrication of circuit packages

H - Electricity

05

K

356/1

H05K 3/34 (2006.01) H01L 21/58 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1147478

HALL-1 FABRICATION OF CIRCUIT PACKAGES Abstract A method of fabricating circuit packages which employ macro-components mounted on supporting substrates. In order to maintain sufficient clearance between the component and substrate and achieve high reliability bonds, massive solder preforms are applied to contact pads on either the component or substrate. After contact pads of both carrier and substrate are brought into contact with the spheres, the bond is formed.

367428

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