Fabrication of printed circuit boards

Details Fabrication of printed circuit boards Fabrication of printed circuit boards

H - Electricity

05

K

117/66, 204/12.5

H05K 1/00 (2006.01) H05K 3/12 (2006.01)

Patent

CA 1042734

Abstract of the Disclosure The invention is directed to a printed circuit board comprising a substrate having a hydrocarbon polymer surface where the hydrocarbon polymer is based upon an elastomeric com- ponent of a conjugated diene polymer such as a polybutadiene, and a thermosetting component such as a phenolic, and where a metal coating is directly bonded by additive plating, including electroless deposition, to at least a portion of the hydrocarbon polymer. Such circuit boards are characterized by a superior bond between the metal coating and the hydrocarbon polymer and one preparational method involves metalizing the hydrocarbon polymer either in an uncured or partially cured state, and thereafter completing the cure of the hydrocarbon polymer to produce a bond between the polymer and the metal coating of su- perior strength.

163581

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