Fabrication of rectangular relief profiles in photoresist

G - Physics – 02 – B

Patent

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Details

96/247, 88/0.1

G02B 5/28 (2006.01) G02B 5/18 (2006.01) G02B 27/42 (2006.01) G03F 7/00 (2006.01)

Patent

CA 1080009

Abstract of the Disclosure By providing a given thickness for a positive photoresist layer on a substrate which, if unexposed, after development has a maximum depth just equal to the sum of the individual depths of two, at least partly superimposed, rectungular relief-profile diffraction gratings in the developed photoresist layer, it is possible to make a single master recording, which can be used to provide a stamper for embossing two of the three primary colors in a single surface of a transparent plastic sheet in the fabrication of diffractive subtractive filters. -1-

270577

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