Fabrication of semiconductor modules with ceramic substrates...

Details Fabrication of semiconductor modules with ceramic substrates... Fabrication of semiconductor modules with ceramic substrates...

G - Physics

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G01N 21/64 (2006.01) H01L 21/48 (2006.01) H01L 21/66 (2006.01) H05K 1/02 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1182591

FABRICATION OF SEMICONDUCTOR MODULES WITH CERAMIC SUBSTRATES AND DETECTION OF RESIDUAL GLASS Abstract of the Disclosure To detect residual glass, such as appears at semiconductor chip pads and via holes during the fabrication of alumina/glass ceramic substrates that are used as supports for the semiconductor devices, the glass used for forming the ceramic substrates is doped with a rare earth oxide. During the manufacturing process, the ceramic structures are irradiated after firing with radiation of wavelengths in the range 350- 500 nanometers to induce the glass to fluoresce, thereby revealing the residual glass on the surface of the metallic interconnector pads. If residual glass is present, the parts are reworked, or scrapped if necessary.

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