Fabrication of thermoelectric modules and solder for such...

Details Fabrication of thermoelectric modules and solder for such... Fabrication of thermoelectric modules and solder for such...

H - Electricity

01

L

H01L 35/08 (2006.01) H01L 35/10 (2006.01)

Patent

CA 2233979

A thermoelectric module (10) is formed with solder joints (28 30), the solder containing about 50 to 99 weight percent bismuth and about 50 to 1 weight percent antimony, between the thermoelectric elements (12, 14) and the connecting conductors (24 26). Also provided is a thermoelectric module (10) having bismuth telluride elements (12 14) coated with a conductive material (16, 18) that does not require a nickel or other diffusion barrier. Further provided are modules (10) having conductors (24, 26) with a phosphorus-nickel surface (20, 22). Methods of manufacturing and using such thermoelectric modules (10) are further provided.

On façonne un module thermoélectrique (10) à l'aide de joints de brasage (28, 30) entre les éléments thermoélectriques (12, 14) et les conducteurs de connexion (24, 26), le métal d'apport de brasage contenant entre 50 et 99 % en poids de bismuth et de 50 à 1 % en poids d'antimoine, environ. L'invention porte également sur un module thermoélectrique (10) pourvu d'éléments (12, 14) en tellurure de bismuth revêtus d'un matériau conducteur (16, 18) n'exigeant pas la présence de nickel ou d'une autre barrière de diffusion. Cette invention concerne, de surcroît, des modules (10) pourvus de conducteurs (24, 26) à surface au phosphore-nickel (20, 22) ainsi que des procédés de fabrication et d'utilisation de ces modules thermoélectriques (10).

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