Fabrication techniques for multilayer ceramic modules

Details Fabrication techniques for multilayer ceramic modules Fabrication techniques for multilayer ceramic modules

H - Electricity

05

K

356/5, 117/64

H05K 3/12 (2006.01) B61L 25/04 (2006.01) H01L 21/48 (2006.01) H01L 23/538 (2006.01) H05K 1/11 (2006.01) H05K 3/40 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/34 (2006.01) H05K 3/46 (2006.01)

Patent

CA 1043189

ABSTRACT The metallization of through-holes in ceramic green sheets where the through-holes are of a diameter which may be less that 0.1 millimeters has been extremely difficult where the through-holes are metallized by silk- screening a conductive paste through a molybdenum mask onto the ceramic green sheet which is mounted on a flat, stable carrier thus completely filling the through-holes. By substituting a carrier capable of absorbing at least some of the components of the conductive paste for the flat, stable carrier it has been discovered that plated through-holes may be obtained by simply removing the carrier from the green sheet. The so removed carrier retains the central portion of the deposited conductive paste and leaves a thin conductive lining in the through-hole. -1-

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