Fast curing epoxy resin compositions

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

400/3029, 400/54

C08G 59/50 (2006.01) C08G 59/68 (2006.01) C08L 57/00 (2006.01) C08L 63/00 (2006.01) C09J 163/00 (2006.01)

Patent

CA 1249691

Abstract of the Disclosure An epoxy resin composition comprising a curable glycidyl ether epoxide group-containing material, an amino-terminated aliphatic polyether curing agent, a polymeric toughening agent, and a catalyst capable of providing an exotherm of at least 20°C. The composition cures rapidly and is useful for providing adhesives which have high peel strength and high lap shear strength at room temperature and after aging at 120°C to 150°C or higher.

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