C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
C22C 11/06 (2006.01) B23K 35/26 (2006.01)
Patent
CA 2078538
The fatigue resistance of lead-tin eutectic solder is increased by doping the solder with less than about 1.0 weight % of a dopant selected from cadmium, indium and antimony. The doped eutectic solder exhibits increased resistance to thermally or mechanically induced cyclic stress and strain. As a result, the fatigue resistance of the solder joint is increased. Combination of dopants, such as indium and cadmium, in combined amounts of less than 0.5 weight % are especially effective in increasing the fatigue resistance of the lead-tin eutectic solder.
La résistance d'un alliage eutectique plomb-étain à la fatigue est améliorée par dopage de l'alliage avec moins de 1,0 % en poids environ de cadmium, d'indium ou d'antimoine. L'alliage eutectique ainsi dopé résiste mieux aux contraintes et tensions cycliques d'origine thermique ou mécanique. Résultat : les joints obtenus avec l'alliage résistent mieux à la fatigue. La combinaison de dopants, comme l'indium et le cadmium, en quantités combinées de moins de 0,5 % en poids, améliore de façon particulièrement efficace la résistance de l'alliage eutectique plomb-étain à la fatigue.
Raytheon Company
Sim & Mcburney
LandOfFree
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