Feed through structure for optical semiconductor package

Details Feed through structure for optical semiconductor package Feed through structure for optical semiconductor package

H - Electricity

01

S

H01S 5/022 (2006.01) G02B 6/42 (2006.01)

Patent

CA 2471495

An optical semiconductor package for packaging therein an optical semiconductor element includes a stem with a hole, a dielectric sealed into the hole of the stem and including a pair of pin insertion holes, and a pair of high frequency signal pins that penetrate and fit into the pair of pin insertion holes of the dielectric, and constituting differential lines connected to an optical semiconductor element.

Une tige (10) comporte un orifice (74) ; un diélectrique (77) inséré dans l'orifice (74) de la tige (10) comporte deux orifices (80a, 80b) d'insertion de broche ; et deux broches (41a, 41b) de signal haute fréquence, insérées et fixées dans les orifices (80a, 80b) d'insertion de broche du diélectrique (77), forment des lignes différentielles connectées à un élément (LD) (40) semi-conducteur optique.

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