H - Electricity – 01 – R
Patent
H - Electricity
01
R
H01R 43/00 (2006.01) A61N 1/05 (2006.01) H01R 13/52 (2006.01) H01R 43/24 (2006.01)
Patent
CA 2496818
A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
Procédé (10) servant à créer un trou d'interconnexion conducteur de courant électrique. Ce procédé (10) consiste en une première étape (11) de constitution d'une structure conductrice (21) comprenant un composant sacrificiel et un composant non sacrificiel. Au moins une partie de ce composant non sacrificiel peut ensuite être revêtu par un matériau relativement isolant (35) préalablement à la suppression d'au moins une partie du composant sacrificiel de cette structure conductrice. La structure du trou d'interconnexion permet d'obtenir une connexion électrique à travers la paroi du boîtier d'un composant implantable, tout en empêchant le transfert indésirable de matériaux entre l'intérieur du composant et l'environnement immédiat.
Darley Derek Ian
Mccusker Desmond Andrew
Milojevic Dusan
Parker John L.
Borden Ladner Gervais Llp
Cochlear Limited
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