Filled low modulus polysiloxanes

Details Filled low modulus polysiloxanes Filled low modulus polysiloxanes

C - Chemistry, Metallurgy

08

K

400/5320, 400/72

C08K 13/02 (2006.01) C08K 5/42 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1336115

The specification describes and claims filled compositions, e.g. moisture curable sealant compositions which comprise 100 parts by weight of polymeric material comprising a mixture or a reaction product of a polydiorganosiloxane having silicon- bonded hydroxyl groups with a compound containing silicon-bonded alkoxy or alkoxyalkoxy groups, 50 to 200 parts by weight of finely divided filler and an additive which is a reaction product of an organic amine, an oxide, hydroxide, carbonate, bicarbonate or a mixture thereof with a sulphonic acid of the formula RSO3H in which R represents a hydrocarbon group which may be halogenated. The additive is preferably a reaction product of the sulphonic acid and an oxide, hydroxide, carbonate or bicarbonate of magnesium, or calcium and the acid is preferably one in which R represents a group R'C6H4 wherein R' represents an alkyl group having 6 to 18 carbon atoms, for example dodecylbenzenesulphonic acid. The filler is preferably an oxide, hydroxide, carbonate or bicarbonate of calcium, magnesium, barium or zinc or a mixture thereof and has a particle size in the range 0.05 to 5 microns.

580955

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