Filled polyamide composition of enhanced adhesion to coatings

C - Chemistry – Metallurgy – 08 – K

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400/4601, 400/58

C08K 5/34 (2006.01) C08K 5/3492 (2006.01)

Patent

CA 1212192

ABSTRACT OF THE DISCLOSURE A polyamide composition having an enhanced adhesion to coatings, which comprises a polyamide with a ratio of the terminal amino group concentration to the terminal carboxyl group concentration of at least 1.5, an inorganic filler, and a triazine, wherein the amount of the inorganic filler is from 1 to 150 weight parts per 100 weight parts of the polyamide and the amount of the triazine is more than 1 weight part per 100 weight parts of the sum of the polyamide and the inorganic filler.

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