C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
6/212, 400/5334,
C08K 9/06 (2006.01) C08J 9/00 (2006.01) C08K 7/20 (2006.01) C08L 69/00 (2006.01)
Patent
CA 1148300
ABSTRACT OF THE DISCLOSURE Filled thermoplastic resin compositions are provided wherein the filler component is compatible with and does not deleteriously affect the physical properties of the resin. The filler employed is a particulate, solid sphere which can be pre-treated with a surface active agent prior to being incorporated in the resin. The resin composition can also contain other ingredients such is impact modifiers, glass fillers, and the like, and is particularly useful in molding applications.
356071
Myers Donald C.
Wilson Phillip S.
Company General Electric
Eckersley Raymond A.
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