C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/9445
C08K 5/41 (2006.01) C08K 3/26 (2006.01) C08K 5/42 (2006.01) C08K 9/04 (2006.01) C08L 23/02 (2006.01)
Patent
CA 1136791
HOE 79/F 066 FILLER-CONTAINING MOLDING COMPOSITION AND PROCESS FOR ITS MANUFACTURE Abstract of the disclosure: In filler-containing molding compositions a very good compatibility between the hydrophilic filler and the hydro- phobic polymer matrix is obtained by using as adhesion promotor alkali metal salts of alkyl or alkenyl-sulfonic acids or alkyl sulfates, the derivatives thereof and the acids on which the salts are based. The flow properties of the molding compo- sitions and the mechanical properties of the shaped articles made therefrom are improved.
347721
Burg Karlheinz
Herwig Walter
Luders Walter
Van Spankeren Ulrich
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
Hoechst Aktiengesellschaft
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