C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 31/04 (2006.01) C08F 2/44 (2006.01) C08J 3/20 (2006.01) C08K 3/00 (2006.01)
Patent
CA 2357762
The invention relates to a filler-containing polymer dispersion which contains inorganic filler particles and particles of at least one synthetic organic polymer. The ratio of the particle size of the filler particles to the particle size of the polymer particles is 1.1:1 to 20:1. The invention also relates to the production and to the use thereof, for example in adhesive or surface coating agents.
L'invention concerne une dispersion polymère contenant une charge. Cette dispersion comprend des particules de charge inorganiques et des particules d'au moins un polymère organique synthétique. Le rapport de la grandeur particulaire des particules de la charge à la grandeur particulaire des particules polymères est de 1,1:1 à 20:1. L'invention concerne un procédé permettant de préparer ladite dispersion et son utilisation, par exemple dans des adhésifs ou des agents de recouvrement de surface.
Henkel Ag & Co. Kgaa
Henkel Chile S.a.
Henkel Kommanditgesellschaft Auf Atkien
Norton Rose Or S.e.n.c.r.l. S.r.l./llp
LandOfFree
Filler-containing polymer dispersion, method for its... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Filler-containing polymer dispersion, method for its..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Filler-containing polymer dispersion, method for its... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1419154