Filler for electronic element encapsulation resin and...

Details Filler for electronic element encapsulation resin and... Filler for electronic element encapsulation resin and...

C - Chemistry, Metallurgy

08

L

6/212, 400/7032

C08L 61/04 (2006.01) C08K 3/36 (2006.01) C08K 7/18 (2006.01) C08L 63/00 (2006.01) C08L 67/06 (2006.01) H01L 23/29 (2006.01) H05K 3/28 (2006.01) H05K 7/00 (2006.01)

Patent

CA 1255049

ABSTRACT OF THE DISCLOSURE: According to the invention, a filler for an electronic element encapsulation resin composition is provided. The filler comprises 5 to 95 parts by weight of fused silica beads of generally spherical form and 95 to 5 parts by weight of crushed particles of fused silica of rugged form. The resin composition admixed with the filler has excellent fluidity without the formation of burs when molded.

467907

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