C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
6/212, 400/7032
C08L 61/04 (2006.01) C08K 3/36 (2006.01) C08K 7/18 (2006.01) C08L 63/00 (2006.01) C08L 67/06 (2006.01) H01L 23/29 (2006.01) H05K 3/28 (2006.01) H05K 7/00 (2006.01)
Patent
CA 1255049
ABSTRACT OF THE DISCLOSURE: According to the invention, a filler for an electronic element encapsulation resin composition is provided. The filler comprises 5 to 95 parts by weight of fused silica beads of generally spherical form and 95 to 5 parts by weight of crushed particles of fused silica of rugged form. The resin composition admixed with the filler has excellent fluidity without the formation of burs when molded.
467907
Ide Ryoichi
Kobayashi Akira
Koga Hirotaka
Denki Kagaku Kogyo Kabushiki Kaisha
Marks & Clerk
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