Filler for heat-conductive plastics materials

Details Filler for heat-conductive plastics materials Filler for heat-conductive plastics materials

C - Chemistry, Metallurgy

08

K

C08K 3/28 (2006.01) C01B 21/072 (2006.01)

Patent

CA 2088954

FM/6-18966/A Filler for heat-conductive plastics materials Abstract of the Disclosure A powder mixture of aluminium nitride in the form of sintered agglomerates with fractions of different particle size, which mixture comprises (1) 80 to 50 % by weight of aluminium nitride in the form of sintered agglomerates having a mean particle diameter of 30 to 50 µm, and (2) 20 to 50 % by weight of aluminium nitride in the form of unsintered particles and having a mean particle diameter of 0.1 to 5 µm. The mixture is suitable for use as filler for polymer materials, especially for casting resins, from which moulded parts of high thermal conductivity can be fabricated, for example potted electronic components.

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