Filler for heat-conductive thermosetting resins

Details Filler for heat-conductive thermosetting resins Filler for heat-conductive thermosetting resins

C - Chemistry, Metallurgy

09

C

C09C 1/40 (2006.01) C01F 7/02 (2006.01) C08K 3/10 (2006.01) C08K 3/22 (2006.01) C08L 101/00 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2061093

FM/6-18531/A Filler for heat-conductive thermosetting resins Abstract of the Disclosure A powder mixture of alumina with fractions of different particle size and external shape, which mixture comprises: (1) 55 to 75 % by volume of spherical .alpha.-alumina, at least 90 % by weight of which has an average particle size of 20 to 120 µm, (2) 35 to 20 % by volume of spherical alumina, at least 90 % by weight of which has an average particle size of 3 to 25 µm, and (3) 10 to 1 % by volume of alumina, at least 90 % by weight of which has a particle size of 1 to 7 µm, the percentages by volume adding up to 100 %. The mixture is suitable for use as filler for synthetic resins, especially for casting resins, from which shaped articles of high thermal conductivity can be produced.

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