Filling and/or sealing orifices, cavities or voids in...

Details Filling and/or sealing orifices, cavities or voids in... Filling and/or sealing orifices, cavities or voids in...

B - Operations, Transporting

05

D

101/119, 204/91.

B05D 3/06 (2006.01) B05D 5/04 (2006.01) B41F 27/12 (2006.01) B41N 3/00 (2006.01) B41N 3/03 (2006.01) B41N 6/02 (2006.01)

Patent

CA 2017497

- 22 - O.Z. 0050/40893 Abstract of the Disclosure: Orifices, cavities or voids which are formed when printing plates resistant to alcoholic printing ink solvents are mounted on a plate cylinder are filled and/or sealed by means of a photo- curable sealing or filling compound consisting of one or more photopolymerizable, ethylenically unsaturated low molecular weight compounds (a), one or more polymeric binders (b) which are compatible with the photopolymeriz- able low molecular weight compounds of component (a), one or more photopolymerization initiators (c) and conventional assistants and additives (d). After it has been applied, this sealing or filling compound is cured by exposure to light and may be machined.

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