C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 14/50 (2006.01) C23C 14/08 (2006.01) C23C 14/28 (2006.01) C23C 14/46 (2006.01)
Patent
CA 2436750
A film deposition method and apparatus capable of forming a film on a substrate having a large area are provided. The film deposition method of forming a film by scattering a deposition material from a surface of a target material (14) and depositing the scattered deposition material onto a surface of a substrate (12), comprising a step of arranging the substrate (12) and the target material (14) such that the surface of the substrate (12) forms an angle to the surface of the target material (14), and a deposition step of forming the film on the substrate (12) in such a manner that an area of a film surface is continuously increased in a two-dimensional direction, while moving a relative position of the substrate (12) with respect to the target material (14).
L'invention concerne un procédé filmogène et un dispositif filmogène permettant de former un film sur un substrat à grande surface. Le procédé filmogène consiste à projeter une matière filmogène de la surface d'un matériau cible (14) pour déposer ladite matière filmogène projetée sur la surface du substrat (12), consistant à disposer le substrat (12) et le matériau cible (14) de manière que la surface du substrat (12) forme un angle par rapport à la surface du matériau cible (14), et à former le film sur le substrat (12) de manière que la zone de surface du film augmente de manière continue d'un point de vue bi-dimensionnel tout en déplaçant la position relative du substrat (12) par rapport au matériau cible (14).
Hahakura Shuji
Ohmatsu Kazuya
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
Sumitomo Electric Industries Ltd.
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