Film forming apparatus

C - Chemistry – Metallurgy – 30 – B

Patent

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148/2.4

C30B 25/12 (2006.01)

Patent

CA 1313813

Abstract of the Disclosure A film forming apparatus comprises a reaction furnace having a reaction chamber therein, injection nozzles for introducing a reactive fluid, provided on the reaction furnace, a discharge nozzle for discharging a reactive fluid, provided on the reaction furnace, and a pair of susceptors located in almost vertical position in the reaction chamber and having opposing sides separated for a specified distance. The susceptor includes a plurality of depressions formed in the oppo- site side, for holding a plurality of silicon wafer. The paired susceptors are rotated in mutually opposite directions.

557115

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