Film forming solution, porous film obtained therefrom and...

Details Film forming solution, porous film obtained therefrom and... Film forming solution, porous film obtained therefrom and...

C - Chemistry, Metallurgy

08

G

C08G 73/10 (2006.01) B01D 71/64 (2006.01) B32B 15/08 (2006.01) C08L 79/08 (2006.01) C09D 179/08 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2115334

ABSTRACT OF THE DISCLOSURE A film forming solution which does not require aprotic polar solvents, a porous film of poly(4,4'- oxydiphenylenepyromellitimide) obtained from the film forming solution which has excellent heat and chemical resistances, which is controllable in terms of porosity and pore size of the film and which has excellent electrical characteristics, and a coated material where the porous film is formed on a base material. Particularly, a film forming solution of a precursor of poly(4,4'-oxydiphenylenepyromellitimide) and a mixture of at least three solvents which are poor solvents for the precursor when each solvent is used alone, a porous film of poly(4,4'-oxydiphenylenepyromellitimide) obtained from the film forming solution and a coated material where the porous film is formed on a base material. - 35 -

Affiliated with

Also associated with

Rating

Film forming solution, porous film obtained therefrom and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film forming solution, porous film obtained therefrom and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film forming solution, porous film obtained therefrom and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1440906