C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 16/50 (2006.01) B05D 1/04 (2006.01) C03B 19/12 (2006.01) C03B 19/14 (2006.01) C03C 17/23 (2006.01) C03C 17/25 (2006.01) C03C 17/32 (2006.01) C04B 41/45 (2006.01) C04B 41/81 (2006.01) C23C 16/40 (2006.01) C23C 16/44 (2006.01) C23C 16/448 (2006.01) C23C 18/12 (2006.01) C30B 7/00 (2006.01)
Patent
CA 2240625
A method of depositing a material onto a substrate comprises the steps of: (a) feeding a material solution comprising one or more precursor compounds, a solvent and a pH-modifying catalyst to an outlet to provide a stream of droplets of the material solution; (b) generating an electric field to electrostatically attract the droplets from the outlet towards the substrate; and (c) providing an increase in temperature between the outlet and the substrate.
L'invention porte sur un procédé de dépôt d'un matériau sur un substrat comprenant les étapes suivantes: (a) alimenter une buse de manière à constituer un brouillard de gouttelettes d'une solution comportant un ou plusieurs composés précurseurs, un solvant et un catalyseur modifiant le pH; (b) créer un champ électrique attirant électrostatiquement les gouttelettes vers le substrat; et (c) créer un accroissement de température entre la buse et le substrat.
Bai Wei
Choy Kwang-Leong
Imperial College Of Science Technology & Medicine
Sim & Mcburney
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