C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 4/12 (2006.01)
Patent
CA 2290985
A method of depositing a material onto a substrate comprises the steps of feeding a material solution to an outlet to provide a stream of droplets of the material solution; ap-plying a potential difference between the outlet and the substrate to electro-statically attract the droplets from the outlet towards the substrate, so that a corona discharge is formed around the outlet; heating the substrate to provide an increase in temperature between the outlet and the substrate; and progressively increasing the temperature of the substrate during deposition of the material.
Procédé de dépôt d'un matériau sur un substrat, ce qui consiste à alimenter une sortie en une solution de matériau afin de produire un flux de gouttelettes de cette solution; à appliquer une différence de potentiel entre la sortie et le substrat afin d'exercer une attraction électrostatique sur les gouttelettes depuis la sortie vers le substrat, de manière à produire une effluve autour de la sortie; à réchauffer le substrat afin d'augmenter la température entre la sortie et le substrat; à augmenter progressivement la température du substrat pendant le dépôt du matériau.
Bai Wei
Choy Kwang-Leong
Gowling Lafleur Henderson Llp
Imperial College Of Science Technology And Medicine
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