Film trimming of laminated photosensitive layer

Details Film trimming of laminated photosensitive layer Film trimming of laminated photosensitive layer

B - Operations, Transporting

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B32B 7/06 (2006.01) B26F 3/02 (2006.01) B26F 3/06 (2006.01) B32B 27/06 (2006.01) G03F 7/16 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1270737

TITLE PD-2285 FILM TRIMMING OF LAMINATED PHOTOSENSITIVE LAYER ABSTRACT OF THE DISCLOSURE A process is disclosed for separating a series of substrate elements laminated with a supported photosensitive composition whereby the support is weakened by heating in a line pattern along abutting edges of the substrate prior to pulling the laminated substrates apart.

527890

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