Fine line repair technique

H - Electricity – 01 – L

Patent

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Details

356/12, 356/183,

H01L 21/30 (2006.01) H01L 21/48 (2006.01) H01L 21/768 (2006.01) H01L 23/525 (2006.01) H05K 3/22 (2006.01) H05K 3/46 (2006.01)

Patent

CA 1139018

Abstract Repair of opens and shorts in semiconductor pack- ages and chip metallurgy by initial conversion of shorts into opens by severing of lines about the shorts, followed by interconnection of conductor patch lines to the good circuit portions through an insulating layer.

352389

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