Fine pitch component placement method and apparatus

Details Fine pitch component placement method and apparatus Fine pitch component placement method and apparatus

H - Electricity

05

K

H05K 3/34 (2006.01) B23K 37/04 (2006.01) H05K 3/12 (2006.01) H05K 3/30 (2006.01)

Patent

CA 2281713

An apparatus and method for aligning fine pitch electrical components (14) and for solder paste stenciling includes a template (20, 40) for aligning an electrical component (14) and for aligning a solder stencil (60, 70). The template (20, 45) has a window (30, 50) with shelves on opposite sides. Tape is adhered to the shelves across the window (30, 50) and is used to secure the template (20, 40) to the desired location on the printed circuit board (10). The template (20, 40) also includes upright tabs that engage notches (66, 76) in theedges of the stencil for aligning the stencil (60, 70). A two-headed vacuum lifting device (120) is used to lift an aligned component (14) and an aligned stencil (60, 70) from the template. With the template (20, 40) removed from the printed circuit board (10), the stencil (60, 70) is replaced in the aligned position for solder application. The stencil (60, 70) is removed and the electrical component (14) is placed for soldering.

L'invention porte sur un appareil et un procédé de positionnement de composants électriques (14) selon des pas très fins et de pochage de la pâte à souder comportant un gabarit (20, 40) d'alignement du composant (14) électrique et du pochoir (60, 70) à pâte. Le gabarit (20, 40) présente une fenêtre (30, 50) munie de tablettes de ses deux côtés. Un ruban fixé aux tablettes et traversant la fenêtre (30, 50) sert à placer le gabarit (20, 40) à l'endroit voulu sur la plaquette (10) du circuit. Le gabarit (20, 40) comporte également des languettes verticales s'engageant dans des fentes (66, 76) pratiquées dans les bords du pochoir pour aligner le pochoir (60, 70). Un dispositif de levage (120) à succion à deux têtes permet de soulever et de séparer du gabarit un composant (14) et le pochoir (60, 70) ayant été alignés. Une fois le gabarit (20, 40) retiré de la plaquette (10) de circuit, le pochoir (60, 70) est repositionné en vue de l'opération de soudure. On retire ensuite le pochoir (60, 70) et on met en place le composant (14) électronique en vue de sa soudure.

Affiliated with

Also associated with

Rating

Fine pitch component placement method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fine pitch component placement method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fine pitch component placement method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1524482