H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/40 (2006.01) H01L 21/48 (2006.01) H01L 23/36 (2006.01) H01L 23/367 (2006.01) H05K 7/20 (2006.01)
Patent
CA 2431520
A method of enhancing the heat dissipating properties of a rigid substrate plate through creation of an array of erect spaced-apart parallelly disposed metallic fins projecting from the heat dissipating surface of the plate. The fins are created by superimposing a sheet of metallic foil upon a metallic plate, with the foil being bonded to the plate by welding utilizing ultrasonic energy. The welds are formed as spaced-apart parallel bands, with the foil being slit adjacent one edge of the band, with the foil thereafter being folded outwardly to form the heat dissipating metallic foil fins. The folding operation is undertaken following the steps of populating the substrate, thereby eliminating the requirement for unusual steps or precautions to protect what otherwise would be outwardly extending metallic fins.
Ridout & Maybee Llp
The Bergquist Company
LandOfFree
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