Flame-resistant photo-curable resin composition

G - Physics – 03 – F

Patent

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Details

G03F 7/028 (2006.01) G03F 7/004 (2006.01) G03F 7/027 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2056640

Abstract of the Disclosure A flame-resistant, photo-curing resin comosition of the present invention consists of: (a) 35 to 65 parts by weight of an acrylic thermoplastic polymer, the acrylic thermoplastic polymer being 15 to 30% by weight copolymerized with at least one of monomer containing an alpha, beta-unsaturated carboxyl group. (b) 5 to 30 parts by weight of a bromine-substituted monomer represented by a general formula [I]: Image ....[I] wherein R1 is H or CH3, A is Image or Image , wherein R2 is an alkylene group containing two or three carbon atoms, n is an integer between 1 and 4, and X1, X2, and X3 are Br or H, under a condition that at least two of the X1, X2, and X3 are Br, (c) 0 to 10 parts by weight of antimony trioxide particles with an average diameter of 0.1 µm or smaller, (d) 20 to 50 parts by weight of a vinyl monomer, excluding compo- nent (b), and (e) 0.01 to 10 parts by weight of a photo-polymerizing initiator, wherein a total amount of the component (a), (b), (c), (d), and (e) is 100 parts by weight.

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