Flat cooling structure of integrated circuit

H - Electricity – 05 – K

Patent

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356/3

H05K 7/20 (2006.01) H01L 23/473 (2006.01)

Patent

CA 1303238

ABSTRACT OF THE DISCLOSURE A circuit assembly is disclosed with circulation of coolant. A plurality of integrated circuit chips are arranged on a substrate separately from each other in rows and columns. A circulating unit disposed on the substrate and having a planar shape circulates coolant therethrough. The circulating unit has within its bottom side a plurality of cells arranged in rows and columns correspondingly to the plurality of chips. Each individual cell is thermally connected to the corresponding individual chip so as to receive therefrom heat generated thereby, The circulating unit includes a distributor for distributing to the respective cells the circulated coolant effective to absorb the heat received in the respective cells.

599031

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