Flexible base materials, their preparation and their use for...

Details Flexible base materials, their preparation and their use for... Flexible base materials, their preparation and their use for...

B - Operations, Transporting

32

B

117/184

B32B 15/08 (2006.01) B05D 3/02 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1184814

Flexible base materials, their preparation and their use for printed circuits Abstract Flexible base materials which consist of a metal foil and a film which firmly adheres thereto without an intermediate layer and consists of a polyamide, polyimide or polyamide-imide, containing siloxane groups, which is obtainable by crosslinking a silicon-modified polyamide prepolymer, polyamide-acid prepolymer or polyamide-amido- acid prepolymer of the formula I. The individual symbols are defined in claim 1. The base materials according to the invention are useful for the production of flexible printed circuits.

385713

Affiliated with

Also associated with

Rating

Flexible base materials, their preparation and their use for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flexible base materials, their preparation and their use for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible base materials, their preparation and their use for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1193405