Flexible base materials, their preparation and their use for...

Details Flexible base materials, their preparation and their use for... Flexible base materials, their preparation and their use for...

B - Operations, Transporting

32

B

117/196

B32B 15/08 (2006.01) B05D 7/14 (2006.01) H05K 1/03 (2006.01) H05K 1/05 (2006.01)

Patent

CA 1182693

Flexible base materials, their preparation and their use for printed circuits Abstract Flexible base materials consisting of a metal foil and a film, firmly adhering thereto without an interlayer, of a polyamide/polyimide block copolymer of the formula I, or of a polyamide/polyimide copolymer prepared from a poly- amide acid block of the formula IVa or Va and a dicarboxylic acid dichloride of the formula XI and a diamine of the formula XII. The individual symbols are defined in claim 1. The base materials according to the invention are suitable for the preparation of flexible printed circuits.

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