Flexible base plate for printed circuit board and a method...

Details Flexible base plate for printed circuit board and a method... Flexible base plate for printed circuit board and a method...

H - Electricity

05

K

356/4

H05K 3/00 (2006.01) H05K 3/38 (2006.01) H05K 1/00 (2006.01)

Patent

CA 1211227

ABSTRACT OF THE DISCLOSURE The invention provides a method for the preparation of a flexible base for printed circuit board of the type formed of lamination of a flexible sheet-like polymeric base and a metal, e.g. copper, foil adhesively bonded to the surface thereof by use of an adhesive, in which the surface of the polymeric base prior to bonding of the metal foil is sub- jected to exposure to low temperature plasma so that the ad- hesive bonding strength between the polymeric base and the metal foil can be greatly improved.

453553

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