Flexible circuit reflow soldering method and apparatus

Details Flexible circuit reflow soldering method and apparatus Flexible circuit reflow soldering method and apparatus

B - Operations, Transporting

23

K

113/80

B23K 1/00 (2006.01) B23K 1/015 (2006.01) B23K 3/00 (2006.01) H05K 3/34 (2006.01) H05K 1/00 (2006.01)

Patent

CA 1081550

FLEXIBLE CIRCUIT REFLOW SOLDERING METHOD AND APPARATUS Abstract of the Disclosure A process and machine are disclosed for reflowing solder plated continuous flexible circuit webs. During reflow in a vapor environment, the flexible web is maintained in a planar orientation to produce a relatively uniform distribution of solder. Virtually all of the heat transfer fluid used in producing the vapor is recovered and retained.

306313

Affiliated with

Also associated with

Rating

Flexible circuit reflow soldering method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flexible circuit reflow soldering method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible circuit reflow soldering method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-641