Flexible circuits and carriers and process for manufacture

Details Flexible circuits and carriers and process for manufacture Flexible circuits and carriers and process for manufacture

H - Electricity

05

K

H05K 3/28 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 3/38 (2006.01) H05K 1/00 (2006.01)

Patent

CA 2297212

A flexible circuit carrier (1) including at least one layer of polymer dielectric material (2), at least one layer of conductive material (3) thereover, each layer having two major surfaces, at least one of said layers having at least one aperture therein, wherein at least one layer has a material (4) coated on at least a portion thereof having a Young's Modulus of from 100 to 200 GPa, a dielectric constant (between 45 MHz and 20 GHz) of from 8 to 12, and a Vickers hardness of from 2000 to 9000 kg/mm2 namely diamond- like carbon.

Support (1) de circuit flexible comprenant au moins une couche de matériau (2) polymère diélectrique recouverte par au moins une couche de matériau conducteur (3), chaque couche possédant deux surfaces principales, au moins une desdites couches étant pourvue d'au moins une ouverture, au moins une partie d'au moins une couche étant revêtue d'un matériau (4) possédant un module de Young de 100-200 GPa, une constante diélectrique (entre 45 MHz et 20 GHz) de 8-12 et une dureté de Vickers de 2000 à 9000 kg/mm?2¿ et consistant notamment en un carbone semblable à du diamant.

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