Flexible multilayer polyimide laminates

B - Operations – Transporting – 05 – D

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

154/106, 117/142

B05D 7/04 (2006.01) B32B 27/08 (2006.01) B32B 27/28 (2006.01) B32B 27/34 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1284922

ABSTRACT Flexible multilayer laminates have at least one layer of a no longer formable, fully aromatic polyimide directly joined on one side to a layer of substrate material and, on the other side, to a layer of a heat- sealable high-temperature adhesive, the high-temperature adhesive is selected from polyacrylates, polysulfone resins, epoxy resins, fluoropolymer resins, silicone resins and butyl rubbers; two basic elements of this structure may be joined to one another on the heat- sealable high-temperature adhesive side; further layers may be joined; the laminates may be produced by a temperature controlled process; the substrate materials are preferably foils of metals or alloys; the multilayer laminates obtained are distinguished by outstanding mechanical, thermal and electrical properties; they may be used as reinforcing materials and for printed electri- cal circuits.

502503

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Flexible multilayer polyimide laminates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flexible multilayer polyimide laminates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible multilayer polyimide laminates will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1242237

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.