Flexible printed circuit fabrication method and device and...

Details Flexible printed circuit fabrication method and device and... Flexible printed circuit fabrication method and device and...

H - Electricity

05

K

H05K 3/40 (2006.01) B23K 26/04 (2006.01) B23K 26/36 (2006.01) B23K 26/40 (2006.01) H05K 1/11 (2006.01) H05K 3/00 (2006.01) H05K 3/26 (2006.01) H05K 1/02 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2055452

A method for rapidly and accurately stripping certain areas (10, 11) of a printed circuit (6), both on conductors (3) and next to them. The areas to be stripped (10, 11) on a blank covered entirely or in part with an insulating coating (4, 5) are machined with a machining head having one or more laser beams controlled by a computer which receives the coordinates of said areas. The strength of the beam is modulated differently for the conducteurs (3) and the areas next to them, as well as when piercing the circuit or cutting around its edges. The method can be used for the manufacture of flexible printed circuits.

- 12 - Abrégé Procédé de fabrication de circuits imprimés souples, circuit imprimé \ fabriqué par ce procédé, et dispositif pour la mise en oeuvre de ce procédé.- L'invention concerne un procédé permettant de dénuder des zones (10,11)d'un circuit imprimé (6), d'une manière rapide et précise, aussi bien sur des conducteurs (3) qu'à côté de ceux-ci. On travaille sur une ébauche pourvue d'un revêtement isolant (4,5) pouvant couvrir tout sa surface. Sur les zones (10,11) à dénuder, on attaque le revêtement au moyen d'une tête d'usinage à un ou plusieurs faisceaux laser, commandée par un calculateur recevant les coordonnées des zones. La puissance du faisceau est modulée différemment sur les conducteurs (3) et à côté d'eux, ainsi que pour percer le circuit ou pour le découper sur son pourteur. Application à la fabrication de circuits imprimés souples. Figure 3.

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