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Patent
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H05K 1/00 (2006.01) H05K 1/02 (2006.01) H05K 3/00 (2006.01) H05K 3/04 (2006.01) H05K 3/34 (2006.01) H05K 1/11 (2006.01) H05K 3/06 (2006.01)
Patent
CA 1138122
ELECTRONIC CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME ABSTRACT OF THE DISCLOSURE This is directed to an electronic circuit device using a flexible printed wiring board having a conductive foil formed on the surfaces of a flexible base material such as phenol resin or the like, wherein a peripheral edge strip is formed on the periphery of the flexible base material. An electronic part is mounted and connected to the circuit conductive foil. Since the flexible base material is extremely thin and flexible, the electronic circuit device can be constructed smaller and thinner.
337487
Nogawa Kenji
Okada Yoshifumi
Takemura Katsuyoshi
Kirby Eades Gale Baker
Matsushita Electric Industrial Co. Ltd.
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