Flexures and method for creating flexures in a wafer

Details Flexures and method for creating flexures in a wafer Flexures and method for creating flexures in a wafer

G - Physics

01

P

26/112, 73/42

G01P 15/00 (2006.01) F16C 11/12 (2006.01) G01P 15/08 (2006.01)

Patent

CA 2010609

FLEXURES AND METHOD FOR CREATING FLEXURES IN A WAFER Abstract of the Disclosure Flexures, and a method for creating flexures, for use in micromechanical sensors such as accelerometers in which a first member (124) is pivotally connected to a second member (126). In one aspect, the invention provides first and second flexures (108, 118) connecting the first and second members, the flexures permitting rotation about a common hinge axis (128). The flexures have a crossed configuration that provides increased stability. Each flexure is made byetching grooves (100, 102, 110, 112) in the opposite wafer surfaces, the positions and depths of the grooves being selected so as to form a flexure therebetween.

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