Flip-chip component packaging process and flip-chip component

Details Flip-chip component packaging process and flip-chip component Flip-chip component packaging process and flip-chip component

H - Electricity

01

L

H01L 23/552 (2006.01) H01L 21/56 (2006.01) H01L 23/48 (2006.01) H01L 23/58 (2006.01)

Patent

CA 2516058

A flip-chip package comprises a substrate having at least one layer and a component flip-chip mounted to the substrate, the component having a field termination ring. The flip-chip package further comprises a shield plane interposed between the at least one layer of substrate and the field termination ring.

L'invention concerne un conditionnement de composant retourné qui comprend un substrat présentant au moins une couche et un composant monté retourné sur le substrat, ce composant présentant un anneau de terminaison de champ. Ce conditionnement de composant retourné comprend en outre une surface de blindage interposée entre la ou les couches du substrat et ledit anneau de terminaison de champ.

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