Floor-laying

E - Fixed Constructions – 04 – F

Patent

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Details

E04F 15/04 (2006.01) E04F 21/20 (2006.01)

Patent

CA 2207789

A method of laying floors or like surfaces with desired material, wherein the floors or like surfaces are supported by or comprised of rigid units in the form of boards (2) or like elements. The boards are provided with tongues and grooves on respective edges thereof to enable boards to be joined to mutually adjacent boards. The method is mainly characterized by using boards (2) that have been provided with a friction layer (6) on their undersides. A corresponding friction layer (7) is placed on the underlying sub-floor (1). The boards may be laid loosely on the friction layer of the sub-floor and mutually joined to adjacent boards solely by coaction between the tongues and grooves of respective boards in the absence of any binder. The invention also relates to floor-laying material for use when applying the method.

La présente invention concerne un procédé de pose de parquets ou de revêtements de sol similaires d'une matière au choix. Ces parquets ou revêtements de sol sont maintenus par des unités rigides ou sont constitués d'unités rigides telles que de planches (2) ou des éléments similaires. Sur leurs rives respectives, les planches présentent des languettes et des rainures permettant de faire la jonction entre des planches adjacentes. Le procédé consiste principalement à utiliser des planches (2) pourvues d'une couche de friction (6) sur la face inférieure. Le faux-fond sous-jacent (1) est également garni d'une couche de friction (7) correspondante. Les planches peuvent être posées sans fixation sur la couche de friction du faux-fond et jointes entre elles uniquement par coopération entre les languettes et rainures des différentes planches, sans avoir recours à la moindre colle. L'invention concerne également des matériaux de pose de parquet utilisables dans le cadre de ce procédé.

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